• Downsized MLCCs with top-tier capacitance of 22μF in 2012 size and 47μF in 3216 size, for smoothing and decoupling
• Enables space-saving designs and a reduction in number of components
• AEC-Q200 compliant

TDK Corporation (TSE: 6762) has developed new products in its CGA series of multilayer ceramic capacitors (MLCC) for automotive applications, achieving world-class capacitance^* of 22μF in 2012 size (2.0 x 1.25 x 1.25 mm) and 47μF in 3216 size (3.2 x 1.6 x 1.6 mm). Volume production began in September 2020.

Advanced driver-assistance systems (ADAS) are becoming increasingly important for improving safety. At the same time, a growing number of features supporting autonomous driving have been established. The ICs used to control these features are therefore continuously providing more functionality, and a growing number of smoothing and decoupling MLCCs are used for noise suppression. From the viewpoint of space-saving substrate designs, the demand for downsized, high capacitance MLCCs continues to increase.

The new CGA series achieves smaller sizes and higher capacitance than our conventional products, allowing a reduction in the number of MLCC components, and enabling space-saving designs. TDK will continue to extend the product range and serve the growing range of automotive applications.

^* As of September 2020, according to TDK research

Glossary

• AEC-Q200: Automotive Electronics Council standard for passive automotive components.
• Smoothing: Suppressing and smoothing voltage fluctuations of pulsating voltage in rectified current by charging and discharging high capacitance capacitors.
• Decoupling: Suppressing voltage fluctuations of IC power lines by inserting capacitors between the power line and the ground and by temporarily supplying current when the electrical load abruptly changes.
• ADAS: Advanced Driver-Assistance Systems.

Main applications

• Smoothing and decoupling of power lines for electronic control units (ECU) in automotive applications.

Main features and benefits

• World's highest-class capacitance (22μF in 2012 size, 47μF in 3216 size).
• Downsizing with high capacitance to enable the reduction of the number of components and space-saving designs.
• High reliability due to AEC-Q200 compliance.

Key data